Pricon Microelectronics Technology Page

Technology

For inquires, send us an e-mail by clicking here

This site is best viewed at 1024x768 resolution

This site has been visited :

[IC Sockets and Connectors] [Plastic Moulding] [Printed Wire Board Assembly]

IC Sockets and Connectors

The IC Socket and Connector - Manufacturing Department assembles products that include BGA socket, QFP socket, PLCC socket and connectors. Assembly of Sockets are manned by 500 operators and supported by 65 staff from engineers and supervisors to manager level. Major equipment Include auto contact inserter machines, auto-contact pulling machines, XY and XYZ measurescopes, programmable optical inspection machines and high voltage testers

[Machines and Capabilities] [Sample Products]

icsockets

IC Sockets and Connectors - Machines and Capabilities

Programmable Optical Inspection Machine High Voltage Tester	BGA-FP Auto Inserter Contact Inspection
	Programmable Optical Inspection Machine This machine is used for inspection of terminal pin count of a particular socket. Inspection time ranges from 10sec/socket to 15sec/socket-depending on the grid size applicable to all types of IC socket with pitch dimension ranging from 1.27mm to to a smallest of 0.4mm It uses a 1.30M pixel high resolution camera with a field view capability of 40 x 40 grid size socket.

[IC Sockets...] [Machines....] [Top of Page]
bgafp

	BGA-FP Auto Inserter Machine This machine is used for automatic insertion of contact pins into insulator. It’s mechanically operated by servo motor to drive cam and linkages. It uses PLC base machine program which can cater to a different pin pattern and pin count. Versatile in terms of application to different c/t pitch (ranging from 1.27mm max to a minimum of 0.4mm pitch). Variable speed ranging from 1.2 sec/pin to 0.20sec/pin. Applicable to BGA-fp type only.

[IC Sockets...] [Machines....] [Top of Page]


ccdct

	Contact Inspection Machine This machine is capable of inspecting missing or cut contact and at the same time measuring contact gap opening. Special Features : Inspection time ranges from 20sec/socket to 25sec/socket-depending on socket size Applicable to all IC socket with Pench type contact (BGA & BGA-fp types). It uses a 1.30M pixel high resolution camera with a field view capability of 40 x 40 grid size socket.

[IC Sockets...] [Machines....] [Top of Page]
highvolt

	High Voltage Tester machine This is an electrical tester machine who’s function is to check/detect shorted pins on IC socket, caused by foreign materials that may have entangled with the socket pins or the socket pin itself being shorted. Usually applicable to QFP clam shell type and Open Top type socket. Mechanically operated machine using solenoid valve. Testing time is 18 sec/socket. Has a flexible pedestal base that can cater to a variety of pin pattern, pin population and grip size.

[IC Sockets...] [Machines....] [Top of Page]

icsockets
IC Sockets and Connectors - Sample Products

Ball Grid Array (BGA)	Pin Grid Array (PGA)	Quad Flat Package (QFP)	IC Carrier (ICC)

Fine-Pitch BGA	Thin Small Outline Package (TSOP)	Land Grid Array (LGA)	Land Grid and Pin Grid Array (LG/PGA)

Flexicon (Male)	Power Connector	Board to Board (Female)	Memory Module

[IC Sockets...] [Top of Page]

asdfsdaf

[IC Sockets and Connectors] [Plastic Moulding] [Printed Wire Board Assembly]

Plastic Moulding

The production arm for Contactors and Insulators for Connectors, Sockets and Test & Burn In (TAB). This department also controls the plastic parts for Electronic assembly (PAD link). The total area is 742.5 sq meters and can keep 24 injection molding machines. With the advent of the new technology we can mold parts with very high precision. Our injection molding machines has varied capacities of 40, 50, 75 and 80 tons.

[Machines and Capabilities] [Sample Products]

plastic

Plastic Moulding - Machines and Capabilities

	Our plastic injection machines are high speed, stable, precise and highly digitized which are very suitable for manufacturing of very small parts. The production line has the capability to manufacture parts for SIP, DIP, QFP and Array sockets. Material drying and loading is automatic which ensures efficient and effective material feeding. Separation of product and runner is done by our electro-pneumatic robot. Machine programming is very fast and easy through the interfaced computers. The computer controls the machine that ensures stable and precise manufacturing of parts which is very much ideal for high volume manufacturing (HVM).

Inspection Capability: We use non-contact dimension inspection machines to ensure superior quality with variable magnification from 3 to 150X to measure very minute sizes. The aesthetic inspection machines are 2D and 3D which has magnification from 1 to 50X that ensures capability to view the slightest detail of the product.

	[Plastic...] [Top of Page]

plastic
Plastic Moulding - Sample Products


Connectors	Sockets	QFP (Test and Burn)

Micro-BGA (Test and Burn)	Pitch Distance (0.566)

[Plastic...] [Top of Page]

[IC Sockets and Connectors] [Plastic Moulding] [Printed Wire Board Assembly]
Printed Wire Board Assembly

Product Application Division (PAD) where the Technology of PMI begins have a total Lot area of 5,220 sq. meter, they are known for their state-of-the-art equipment which composed of several SMT lines, Auto Soldering machine, and Axial and Radial Insertion machine. PAD’s Clean Room Class 100K, 10K and 1K which produces flexible circuit board use as cable for high speed digital signal transmission. PAD’s state-of-the-art equipment such as the SMT Chip/IC Mounter which are capable to mount component that varies from the smallest of 0603 chip up to large components like, QFP, BGAs and CSPs, are leading the divisions goal in pursuing to be globally competitive. In addition, PAD’s equipment like Reflow and Auto Soldering machine are all capable for Lead free process. Today, PAD is concentrating in giving high quality products for Hard Disk Drives, Printer Main Board, Laser Scanner Copier Main Board and Memory Card Reader Boards.

[Machines and Capabilities] [Sample Products]

printed

Printed Wired Board Assembly - Machines and Capabilities

Surface Mounting Clean Room N2 Wave Soldering - Lead Free	Pin-thru-hole Auto Insertion Rework Center


Surface Mounting Several SMT lines with capability in mounting chips component, BGA’s and CSP’s in combination with Nitrogen reflow oven capable for lead free process.
	[Printed....] [Machine....] [Top of Page]
asdfasdf
sdfjhsd

Clean Room Facilities PMI offers clean room production services at class 100K, 10K and 1K levels.
	[Printed....] [Machine....] [Top of Page]
sdfsdfsdf



Pin-thru-hole (PTH) Auto Insertion With capability to insert Radial and Axial components.
	[Printed....] [Machine....] [Top of Page]



N2 Wave soldering This soldering line is capable for lead free process.
	[Printed....] [Machine....] [Top of Page]




Rework Center Automated rework center that is capable to mount and dismount QFP’s, BGA’s, and CSP’s

	[Printed....] [Machine....] [Top of Page]

plastic


Printed Wire Board Assembly - Samples Products

3.5 HDD Board	2.5 HDD Board	Printer Mainboard	Copier Mainboard

5-in-1 Card Reader	Battery Pack	High Frequency Graphic Device	Flexible Board
[Printed....] [Top of Page]

Last modified: 21-Feb-2005 12:00:00 AM +0800