Our EMS Division is engaged in Printed Circuit Boards Assembly (PCBA) process and Flexible Printed Circuits Assembly (FPCA) process. Equipped with state-of–the-art equipment composed of SMT machines capable of mounting components that varies from the smallest chips to large components like QFP & BGA.
Manufacturing Capabilities:
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Turnkey manufacturing with multiple materials sourcing sites
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Consignment manufacturing using consigned equipment
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Automated SMT and automated Through-Hole assembly
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Final assembly solutions
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Fine pitch auto placement (BGA, CSP, QFP, chips)
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Lead-Free Nitrogen Reflow Oven Process
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Assembly in clean room (Class 1K/10K/100K)
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DI (De-ionized water system) cleaning
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Testing capabilities (In-Circuit Test, Functional Test)
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RoHS material verification
